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Proceedings Paper

Proposed electro-optic package with bidirectional lensed coupling
Author(s): K. Rajasekharan; Timothy Michalka
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Paper Abstract

Optical packages with multiple optical I/Os and without optical pigtails or conventional connectors are proposed. These conceptual packages are of a hybrid PGA style with LSI chips and arrays of optical sources and detectors. A central theme is the use of only moderate extensions of current single chip and PWB packaging technologies. The light coupling between devices and waveguides is to be achieved using an array of lenses and/or microprisms. The feasibility of such a package is discussed from engineering manufacturing and repairability viewpoints.

Paper Details

Date Published: 1 April 1991
PDF: 12 pages
Proc. SPIE 1389, Microelectronic Interconnects and Packages: Optical and Electrical Technologies, (1 April 1991); doi: 10.1117/12.25557
Show Author Affiliations
K. Rajasekharan, Digital Equipment Corp. (United States)
Timothy Michalka, Digital Equipment Corp. (United States)

Published in SPIE Proceedings Vol. 1389:
Microelectronic Interconnects and Packages: Optical and Electrical Technologies
Gnanalingam Arjavalingam; James Pazaris, Editor(s)

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