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Proceedings Paper

Electrical characterization of the interconnects inside a computer
Author(s): Barry Rubin
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Paper Abstract

Calculations of the electrical characteristics of the signal lines and other interconnects in computer modules have in the past often relied upon simplifying assumptions. For instance the quasi-TEM approximation or circuit models are often applied without proper consideration of the operating frequencies and coupling between package features. Though such approximations in most cases are probably valid it is difficult and time consuming to verify them. A better approach would be to employ a so!- ution technique that does not rely on such approximations in the the first place. This paper describes a rigorous approach to such modeling employing a full-wave Maxwell''s equation solution for determining the propagation characteristics of packages. Arbitrarily shaped 3-D signal lines and their discontinuities can be analyzed structures may include finite-size dielectric regions with material composition that may be anisotropic. The approach involves a method-of-moments solution technique with rooftop basis functions used to represent the surface current on the conductors and the polarization current in the dielectrics. To account for the dielectric regions the dielectric is first replaced by an array of interlocking thin-wall sections the electric field boundary conditions are later applied through the use of surface impedances. In the paper the signal propagation concerns in computer packages are first reviewed. Reflections off discontinuities proximity effects associated with nearby but nontouching other signal lines and vias (OLVs) and crosstalk and its sensitivity to various package parameters

Paper Details

Date Published: 1 April 1991
PDF: 15 pages
Proc. SPIE 1389, Microelectronic Interconnects and Packages: Optical and Electrical Technologies, (1 April 1991); doi: 10.1117/12.25534
Show Author Affiliations
Barry Rubin, IBM/Thomas J. Watson Research Ctr. (United States)

Published in SPIE Proceedings Vol. 1389:
Microelectronic Interconnects and Packages: Optical and Electrical Technologies
Gnanalingam Arjavalingam; James Pazaris, Editor(s)

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