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Proceedings Paper

Analysis and modeling of uniformly- and nonuniformly-coupled lossy lines for interconnections and packaging in hybrid and monolithic circuits
Author(s): Neven Orhanovic; Leonard A. Hayden; Vijai K. Tripathi
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Paper Details

Date Published: 1 April 1991
PDF: 12 pages
Proc. SPIE 1389, Microelectronic Interconnects and Packages: Optical and Electrical Technologies, (1 April 1991); doi: 10.1117/12.25529
Show Author Affiliations
Neven Orhanovic, Oregon State Univ. (United States)
Leonard A. Hayden, Oregon State Univ. (United States)
Vijai K. Tripathi, Oregon State Univ. (United States)


Published in SPIE Proceedings Vol. 1389:
Microelectronic Interconnects and Packages: Optical and Electrical Technologies
Gnanalingam Arjavalingam; James Pazaris, Editor(s)

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