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Proceedings Paper

Application of electrodeposition processes to advanced package fabrication
Author(s): Sol Krongelb; John O. Dukovic; M. L. Komsa; S. Mehdizadeh; Lubomyr T. Romankiw; Panayotis C. Andricacos; A. T. Pfeiffer; Kason Wong
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Paper Details

Date Published: 1 April 1991
PDF: 8 pages
Proc. SPIE 1389, Microelectronic Interconnects and Packages: Optical and Electrical Technologies, (1 April 1991); doi: 10.1117/12.25527
Show Author Affiliations
Sol Krongelb, IBM/Thomas J. Watson Research Ctr. (United States)
John O. Dukovic, IBM/Thomas J. Watson Research Ctr. (United States)
M. L. Komsa, IBM/Thomas J. Watson Research Ctr. (United States)
S. Mehdizadeh, IBM/Thomas J. Watson Research Ctr. (United States)
Lubomyr T. Romankiw, IBM/Thomas J. Watson Research Ctr. (United States)
Panayotis C. Andricacos, IBM/Thomas J. Watson Research Ctr. (United States)
A. T. Pfeiffer, IBM/Thomas J. Watson Research Ctr. (United States)
Kason Wong, IBM/Thomas J. Watson Research Ctr. (United States)


Published in SPIE Proceedings Vol. 1389:
Microelectronic Interconnects and Packages: Optical and Electrical Technologies
Gnanalingam Arjavalingam; James Pazaris, Editor(s)

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