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Proceedings Paper

Measurements and characterization of multiple-coupled interconnection lines in hybrid and monolithic integrated circuits
Author(s): Leonard A. Hayden; Jyh-Ming Jong; John B. Rettig; Vijai K. Tripathi
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Paper Details

Date Published: 1 April 1991
PDF: 10 pages
Proc. SPIE 1389, Microelectronic Interconnects and Packages: Optical and Electrical Technologies, (1 April 1991); doi: 10.1117/12.25524
Show Author Affiliations
Leonard A. Hayden, Oregon State Univ. (United States)
Jyh-Ming Jong, Oregon State Univ. (United States)
John B. Rettig, Tektronix, Inc. (United States)
Vijai K. Tripathi, Oregon State Univ. (United States)


Published in SPIE Proceedings Vol. 1389:
Microelectronic Interconnects and Packages: Optical and Electrical Technologies
Gnanalingam Arjavalingam; James Pazaris, Editor(s)

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