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Proceedings Paper

Sensitivity study of printed wiring board plated-through-holes copper barrel voids
Author(s): Chao-Pin Yeh; Charles Umeagukwu; Robert E. Fulton; William Teat
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Paper Details

Date Published: 1 April 1991
PDF: 12 pages
Proc. SPIE 1389, Microelectronic Interconnects and Packages: Optical and Electrical Technologies, (1 April 1991); doi: 10.1117/12.25522
Show Author Affiliations
Chao-Pin Yeh, Georgia Institute of Technology (United States)
Charles Umeagukwu, Georgia Institute of Technology (United States)
Robert E. Fulton, Georgia Institute of Technology (United States)
William Teat, Motorola, Inc. (United States)


Published in SPIE Proceedings Vol. 1389:
Microelectronic Interconnects and Packages: Optical and Electrical Technologies
Gnanalingam Arjavalingam; James Pazaris, Editor(s)

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