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Proceedings Paper

Switching noise in a medium-film copper/polyimide multichip module
Author(s): Peter A. Sandborn; Seyed Hassan Hashemi; William Weigler
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Paper Abstract

This paper describes the analysis of switching noise in a 9-layer medium film copper/polyimide module. Equivalent circuit models which are used to understand and extend experimental results were constructed using a CAD tool which has been previously described. Results for this vehicle are used to study the dependence of noise magnitude on various module parameters including the number of switching gates the edge rate and the value and placement of bypass capacitance as well as assess the validity of various analytical switching noise models which have appeared in the literature.

Paper Details

Date Published: 1 April 1991
PDF: 10 pages
Proc. SPIE 1389, Microelectronic Interconnects and Packages: Optical and Electrical Technologies, (1 April 1991); doi: 10.1117/12.25521
Show Author Affiliations
Peter A. Sandborn, Microelectronics and Computer Technology Corp. (United States)
Seyed Hassan Hashemi, Microelectronics and Computer Technology Corp. (United States)
William Weigler, Microelectronics and Computer Technology Corp. (United States)


Published in SPIE Proceedings Vol. 1389:
Microelectronic Interconnects and Packages: Optical and Electrical Technologies
Gnanalingam Arjavalingam; James Pazaris, Editor(s)

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