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Proceedings Paper

Electrical characteristics of lossy interconnections for high-performance computer applications
Author(s): Alina Deutsch; Gerard V. Kopcsay; V. A. Ranieri; J. K. Cataldo; E. A. Galligan; W. S. Graham; R. P. McGouey; S. L. Nunes; Jurij R. Paraszczak; J. J. Ritsko; R. J. Serino; D. Y. Shih; Janusz S. Wilczynski
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Paper Abstract

This paper discusses the maximum usable length (''max) for high-speed pulse propagation and its dependence on signal line resistance (R) for a range of wiring technologies. As an example we present results from measurements and analyses of experimental interconnection structures and their agreement is highlighted. The analysis is based on a transmission line model which includes frequency-dependent losses such as skin-effect and dielectric dispersion. The paper addresses the problems found on lossy lines such as reflections rise-time slow down increased delay attenuation and crosstalk. A wide bandwidth test system that relies on novel high frequency and high impedance coaxial probes which was developed to characterize our test structures is described. The limiting factors that affect circuitto- circuit path delays in high-performance computers are then discussed and guidelines are given for maintaining distortion-free propagation of high-speed signals. Simulations of resistive interconnections in a practical digital environment are presented.

Paper Details

Date Published: 1 April 1991
PDF: 16 pages
Proc. SPIE 1389, Microelectronic Interconnects and Packages: Optical and Electrical Technologies, (1 April 1991); doi: 10.1117/12.25520
Show Author Affiliations
Alina Deutsch, IBM/Thomas J. Watson Research Ctr. (United States)
Gerard V. Kopcsay, IBM/Thomas J. Watson Research Ctr. (United States)
V. A. Ranieri, IBM/Thomas J. Watson Research Ctr. (United States)
J. K. Cataldo, IBM/Thomas J. Watson Research Ctr. (United States)
E. A. Galligan, IBM/Thomas J. Watson Research Ctr. (United States)
W. S. Graham, IBM/Thomas J. Watson Research Ctr. (United States)
R. P. McGouey, IBM/Thomas J. Watson Research Ctr. (United States)
S. L. Nunes, IBM/Thomas J. Watson Research Ctr. (United States)
Jurij R. Paraszczak, IBM/Thomas J. Watson Research Ctr. (United States)
J. J. Ritsko, IBM/Thomas J. Watson Research Ctr. (United States)
R. J. Serino, IBM/Thomas J. Watson Research Ctr. (United States)
D. Y. Shih, IBM/Thomas J. Watson Research Ctr. (United States)
Janusz S. Wilczynski, IBM/Thomas J. Watson Research Ctr. (United States)


Published in SPIE Proceedings Vol. 1389:
Microelectronic Interconnects and Packages: Optical and Electrical Technologies
Gnanalingam Arjavalingam; James Pazaris, Editor(s)

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