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Proceedings Paper

Multidisciplinary analysis and design of printed wiring boards
Author(s): Robert E. Fulton; Joseph L.A. Hughes; Waymond R. Scott; Charles Umeagukwu; Chao-Pin Yeh
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Paper Abstract

Modern printed wiring board design depends on electronic prototyping using computer-based simulation and design tools. Existing electrical computer-aided design (ECAD) tools emphasize circuit connectivity with only rudimentary analysis capabilities. This paper describes a prototype integrated PWB design environment denoted Thermal Structural Electromagnetic Testability (TSET) being developed at Georgia Tech in collaboration with companies in the electronics industry. TSET provides design guidance based on enhanced electrical and mechanical CAD capabilities including electromagnetic modeling testability analysis thermal management and solid mechanics analysis. TSET development is based on a strong analytical and theoretical science base and incorporates an integrated information framework and a common database design based on a systematic structured methodology.

Paper Details

Date Published: 1 April 1991
PDF: 12 pages
Proc. SPIE 1389, Microelectronic Interconnects and Packages: Optical and Electrical Technologies, (1 April 1991); doi: 10.1117/12.25517
Show Author Affiliations
Robert E. Fulton, Georgia Institute of Technology (United States)
Joseph L.A. Hughes, Georgia Institute of Technology (United States)
Waymond R. Scott, Georgia Institute of Technology (United States)
Charles Umeagukwu, Georgia Institute of Technology (United States)
Chao-Pin Yeh, Georgia Institute of Technology (United States)


Published in SPIE Proceedings Vol. 1389:
Microelectronic Interconnects and Packages: Optical and Electrical Technologies
Gnanalingam Arjavalingam; James Pazaris, Editor(s)

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