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Proceedings Paper

V-line: a new interconnect for packaging and microwave applications
Author(s): Jose E. Schutt-Aine; Jin-Fa Lee
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Paper Details

Date Published: 1 April 1991
PDF: 6 pages
Proc. SPIE 1389, Microelectronic Interconnects and Packages: Optical and Electrical Technologies, (1 April 1991); doi: 10.1117/12.25516
Show Author Affiliations
Jose E. Schutt-Aine, Univ. of Illinois/Urbana-Champaign (United States)
Jin-Fa Lee, Univ. of Illinois/Urbana-Champaign (United States)


Published in SPIE Proceedings Vol. 1389:
Microelectronic Interconnects and Packages: Optical and Electrical Technologies
Gnanalingam Arjavalingam; James Pazaris, Editor(s)

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