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Proceedings Paper

V-line: a new interconnect for packaging and microwave applications
Author(s): Jose E. Schutt-Aine; Jin-Fa Lee
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Paper Abstract

A new transmission line configuration is presented for microwave and high-speed digital applications. The structure consists of a conducting strip over a triangular ground reference and offer superior electromagnetic performance at higher frequencies with lower radiation and lower coupling between neighboring interconnect lines. Parameters resulting from a static analysis are shown as a function of the geometrical characteristics and a full wave analysis is used to establish the frequency dependence of the propagation constant. Experimental results are compared with the theoretical data to validate the analysis and determine the advantages of the new structure.

Paper Details

Date Published: 1 April 1991
PDF: 6 pages
Proc. SPIE 1389, Microelectronic Interconnects and Packages: Optical and Electrical Technologies, (1 April 1991); doi: 10.1117/12.25516
Show Author Affiliations
Jose E. Schutt-Aine, Univ. of Illinois/Urbana-Champaign (United States)
Jin-Fa Lee, Univ. of Illinois/Urbana-Champaign (United States)


Published in SPIE Proceedings Vol. 1389:
Microelectronic Interconnects and Packages: Optical and Electrical Technologies
Gnanalingam Arjavalingam; James Pazaris, Editor(s)

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