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Proceedings Paper

Design and process impact on thin-film interconnection performance
Author(s): Glenn A. Rinne; Lih-Tyng Hwang; Gretchen M. Adema; Donald A. King; Iwona Turlik
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Paper Abstract

The performance of thin-film interconnections is influenced by the manner in which material selection and design rules interact with process capabilities. To understand this influence analysis of predicted and measured interconnection performance was correlated to design and process attributes. The models employed to predict propagation delay and noise are described and compared to experimental results. Attributes which contribute significantly to successful implementation of this technology are identified and accommodations in process controls and design rules are suggested.

Paper Details

Date Published: 1 April 1991
PDF: 12 pages
Proc. SPIE 1389, Microelectronic Interconnects and Packages: Optical and Electrical Technologies, (1 April 1991); doi: 10.1117/12.25514
Show Author Affiliations
Glenn A. Rinne, Microelectronics Ctr. of North Carolina (United States)
Lih-Tyng Hwang, Microelectronics Ctr. of North Carolina (United States)
Gretchen M. Adema, Microelectronics Ctr. of North Carolina (United States)
Donald A. King, Microelectronics Ctr. of North Carolina (United States)
Iwona Turlik, Microelectronics Ctr. of North Carolina (United States)


Published in SPIE Proceedings Vol. 1389:
Microelectronic Interconnects and Packages: Optical and Electrical Technologies
Gnanalingam Arjavalingam; James Pazaris, Editor(s)

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