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Proceedings Paper

Effects of packaging and interconnect technology on testability of printed wiring boards
Author(s): Joseph L.A. Hughes; Prem Pahlajrai
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Paper Details

Date Published: 1 April 1991
PDF: 11 pages
Proc. SPIE 1389, Microelectronic Interconnects and Packages: Optical and Electrical Technologies, (1 April 1991); doi: 10.1117/12.25512
Show Author Affiliations
Joseph L.A. Hughes, Georgia Institute of Technology (United States)
Prem Pahlajrai, Georgia Institute of Technology (United States)


Published in SPIE Proceedings Vol. 1389:
Microelectronic Interconnects and Packages: Optical and Electrical Technologies
Gnanalingam Arjavalingam; James Pazaris, Editor(s)

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