Share Email Print
cover

Proceedings Paper

Electronic multiprocessor with radiation-hardened optical interconnects
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Optical interconnects will play an increasingly significant role in future space applications, because of their high transmission bandwidth potential and radiation hardness. This paper presents the development results of a hybrid optoelectronic system comprising four electronic processing boards that communicate through an optical 3 by 3 non- blocking crossbar switch. Each processing board contains Tx and Rx modules pigtailed to multimode fibers. An optical fan-out of 1-to-3 is implemented by means of a holographic grating. The fan-in is implemented as a lens array. The system has been tested using dedicated automatic target recognition (ATR) software, and space testing is planned.

Paper Details

Date Published: 18 October 1996
PDF: 9 pages
Proc. SPIE 2811, Photonics for Space Environments IV, (18 October 1996); doi: 10.1117/12.254047
Show Author Affiliations
Andrew A. Kostrzewski, Physical Optics Corp. (United States)
Tomasz P. Jannson, Physical Optics Corp. (United States)
Jeongdal Kim, Physical Optics Corp. (United States)
Gajendra D. Savant, Physical Optics Corp. (United States)
Dai Hyun Kim, Physical Optics Corp. (United States)
Judy Chen, Physical Optics Corp. (United States)


Published in SPIE Proceedings Vol. 2811:
Photonics for Space Environments IV
Edward W. Taylor, Editor(s)

© SPIE. Terms of Use
Back to Top