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Optimization of morphology and electrochemical characteristics of nickel film by sputtering pressure
Author(s): Yongping Luo; Wei Zhong; Chen Liu; Ping Huang; Shunjian Xu; Zonghu Xiao
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Paper Abstract

Nickel (Ni) films with different structure were prepared on fluorine doped tin oxide (FTO) conducting glass by vacuum magnetron sputtering. In this work the effect of sputtering pressure on morphology and electrochemical performances of the as-prepared Ni films was investigated. The morphology and crystal structure of the prepared Ni films were characterized by scanning electron microscope (SEM) and X-ray diffraction (XRD), respectively. The results show the thickness of Ni films decreased with the increase of sputtering pressure owing to the decrease of the deposition rate from 0.6 Pa to 1.8 Pa with an inflection point at 1.2 Pa. The Ni films deposited at sputtering pressure of 1.2 Pa possess the highest specific surface roughness, porosity and abundant island structure, contributing to better electrochemical performance of Ni film.

Paper Details

Date Published: 8 July 2019
PDF: 7 pages
Proc. SPIE 11064, Tenth International Conference on Thin Film Physics and Applications (TFPA 2019), 110640Y (8 July 2019); doi: 10.1117/12.2539881
Show Author Affiliations
Yongping Luo, Xinyu Univ. (China)
Wei Zhong, Xinyu Univ. (China)
Chen Liu, Xinyu Univ. (China)
Ping Huang, Xinyu Univ. (China)
Nanchang Univ. (China)
Shunjian Xu, Xinyu Univ. (China)
Zonghu Xiao, Xinyu Univ. (China)


Published in SPIE Proceedings Vol. 11064:
Tenth International Conference on Thin Film Physics and Applications (TFPA 2019)
Junhao Chu; Jianda Shao, Editor(s)

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