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Proceedings Paper

Wafer bonding technology and its applications in optoelectronic devices
Author(s): Zuhua Zhu; Guilan Ding; Kangsheng Chen; Felix Ejike Ejeckam; Yi Qian; Gina L. Christenson; Yu-Hwa Lo
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Paper Abstract

The new optoelectronic integrated technology--wafer bonding is described. The results of wafer bonding and applications in several new types of optoelectronic devices are presented.

Paper Details

Date Published: 30 September 1996
PDF: 12 pages
Proc. SPIE 2891, Integrated Optoelectronics, (30 September 1996); doi: 10.1117/12.253172
Show Author Affiliations
Zuhua Zhu, Zhejian Univ. (China)
Guilan Ding, Zhejiang Univ. (China)
Kangsheng Chen, Zhejiang Univ. (China)
Felix Ejike Ejeckam, Cornell Univ. (United States)
Yi Qian, Cornell Univ. (United States)
Gina L. Christenson, Cornell Univ. (United States)
Yu-Hwa Lo, Cornell Univ. (United States)


Published in SPIE Proceedings Vol. 2891:
Integrated Optoelectronics
Ray T. Chen; Won-Tien Tsang; BingKun Zhou, Editor(s)

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