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Proceedings Paper

Automated visual inspection system for IC bonding wires using morphological processing
Author(s): Hiroyuki Tsukahara; Masato Nakashima; Takehisa Sugawara
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Paper Abstract

This paper discusses an automated visual inspection system for IC bonding wires that uses high-contrast image capture and an accurate bonding-ball measurement algorithm. On IC assembly lines visual inspection is vital to maintaining IC reliability. Wire bonding requires the automated evaluation of bonding quality to maintain productivity. Both bonding balls and wires must be inspected to evaluate bonding quality. We developed a bonding-ball measurement algorithm based on subpixel and morphological techniques and a wire inspection algorithm based on border following. The automated inspection system measures ball diameters to an accuracy within jim which corresponds to one-half pixel taking 0. 2 seconds to inspect a wire and ball. Paired with a wire bonder the inspection system configures a fully automatic bonding system.

Paper Details

Date Published: 1 February 1991
PDF: 12 pages
Proc. SPIE 1384, High-Speed Inspection Architectures, Barcoding, and Character Recognition, (1 February 1991); doi: 10.1117/12.25306
Show Author Affiliations
Hiroyuki Tsukahara, Fujitsu Labs. Ltd., Atsugi (Japan)
Masato Nakashima, Fujitsu Labs. Ltd., Atsugi (Japan)
Takehisa Sugawara, Fujitsu Ltd. (Japan)

Published in SPIE Proceedings Vol. 1384:
High-Speed Inspection Architectures, Barcoding, and Character Recognition
Michael J. W. Chen, Editor(s)

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