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Leveraging wafer-level manufacturing process limitations to increase large-scale fused silica microlens array uniformity
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Paper Abstract

The wafer-level production of Fused Silica microlens arrays is limited by systematic process non-uniformities. The common molten resist-reflow process with subsequent dry-etching allows for manufacturing of microlens arrays on 200 mm wafers. A thorough process review yielded one free parameter. By switching from the geometrical lens description via radius of curvature and conic constant to a functional assessment via the optical design figure of merit we can describe microlens via their optical quality for the intended application with one parameter for a wide variety of cases. Leveraging these points we show improvements on the uniformity of microlens arrays by a factor of 2 for Fused Silica microlens arrays bigger than 100 mm by 100 mm.

Paper Details

Date Published: 30 August 2019
PDF: 7 pages
Proc. SPIE 11103, Optical Modeling and System Alignment, 111030A (30 August 2019); doi: 10.1117/12.2529195
Show Author Affiliations
Raoul Kirner, SUSS MicroOptics SA (Switzerland)
Jeremy Béguelin, SUSS MicroOptics SA (Switzerland)
Wilfried Noell, SUSS MicroOptics SA (Switzerland)
Martin Eisner, SUSS MicroOptics SA (Switzerland)
Toralf Scharf, Ecole Polytechnique Fédérale de Lausanne (Switzerland)
Reinhard Voelkel, SUSS MicroOptics SA (Switzerland)


Published in SPIE Proceedings Vol. 11103:
Optical Modeling and System Alignment
Mark A. Kahan; José Sasián; Richard N. Youngworth, Editor(s)

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