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Research and analysis of heat exchange processes of a micromechanical mirror based on a thermal microactuator
Author(s): S. Evstafyev; V. Samoylikov
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Paper Abstract

This paper considers the multi-sectional structure of the thermal micromechanical mirror element, developed and manufactured by the National Research University "MIET". The structure consists of a movable part and a fixed part. The movable part includes a pair of thermal microactuators based on a multilayer structure of silicon oxide and aluminum, and a mirror reflecting element coated with aluminum. The fixed part is the area of attachment of the element to the silicon wafer. The temperature distribution along the length of the multi-sectional structure of the thermal microactuator is calculated taking into account the effect of the system of transverse heat-conducting structures under various heating conditions. An essential difference between the calculations, reaching two times, was established. The experimental studies showed the adequacy of the calculation results and proved that the calculation of the temperature distribution should take into account the cooling effect of transverse heat-conducting structures. Based on the calculations and experimental studies, a technique is proposed for analyzing the thermal state of the microactuator that takes into account the cooling effect of the transverse heat-conducting structures.

Paper Details

Date Published: 15 March 2019
PDF: 6 pages
Proc. SPIE 11022, International Conference on Micro- and Nano-Electronics 2018, 110220U (15 March 2019); doi: 10.1117/12.2520519
Show Author Affiliations
S. Evstafyev, National Research Univ. of Electronic Technology (Russian Federation)
V. Samoylikov, National Research Univ. of Electronic Technology (Russian Federation)


Published in SPIE Proceedings Vol. 11022:
International Conference on Micro- and Nano-Electronics 2018
Vladimir F. Lukichev; Konstantin V. Rudenko, Editor(s)

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