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Proceedings Paper

Wafer bonding technique for fabricating 1.5-um InGaAs/InGaAsP pillar-free microdisk lasers
Author(s): Sheng Li Wu; Lijun Wang; Jianping Zhang; Liwei Wang; Seng Tiong Ho
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Paper Abstract

A new wafer bonding-etching technique has been developed successfully for micro-disk laser fabrication. Pillar-free micro-disk lasers have been realized. The micro-disk is placed on low refractive index material such as SiO2 and surrounded by SiO2 and air. The pillar-free micro-disk laser shows more solid than the pillar-supported micro-disk lasers. It has similar threshold pump power compared with the pillar-supported micro-disk lasers.

Paper Details

Date Published: 24 September 1996
PDF: 3 pages
Proc. SPIE 2886, Semiconductor Lasers II, (24 September 1996); doi: 10.1117/12.251909
Show Author Affiliations
Sheng Li Wu, Changchun Institute of Physics (China)
Lijun Wang, Changchun Institute of Physics (China)
Jianping Zhang, Northwestern Univ. (United States)
Liwei Wang, Northwestern Univ. (United States)
Seng Tiong Ho, Northwestern Univ. (United States)

Published in SPIE Proceedings Vol. 2886:
Semiconductor Lasers II
Siamak Forouhar; Qiming Wang, Editor(s)

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