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Actinic metrology platform for defect review and mask qualification: flexibility and performance
Author(s): Renzo Capelli; Martin Dietzel; Dirk Hellweg; Markus Koch; Grizelda Kersteen; Klaus Gwosch; Daniel Pagel
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Paper Abstract

The strong effort to push further Moore’s law is driving the insertion of EUV pilot production at several captive and merchant semiconductor vendors, which already today puts strong demands on actinic tools metrology capabilities. The EUV mask infrastructure plays a central role for the successful introduction of EUV into high volume manufacturing: to provide the mask shop with actinic review capabilities, ZEISS and the SUNY Poly SEMATECH EUVL Mask Infrastructure consortium developed and launched an actinic metrology platform based on aerial imaging technology. Over the last few years, it was demonstrated how this aerial image metrology platform fulfills the mask shop requirements for actinic defect review and repair verification. In this paper we present the latest performance achievements of the platform together with the discussion on platform based capabilities for possible future actinic metrology extensions, with a special emphasis on the AIMSTM EUV solution for high-NA emulation capabilities.

Paper Details

Date Published: 10 June 2019
PDF: 8 pages
Proc. SPIE 10957, Extreme Ultraviolet (EUV) Lithography X, 109570X (10 June 2019); doi: 10.1117/12.2518596
Show Author Affiliations
Renzo Capelli, Carl Zeiss SMT GmbH (Germany)
Martin Dietzel, Carl Zeiss SMT GmbH (Germany)
Dirk Hellweg, Carl Zeiss SMT GmbH (Germany)
Markus Koch, Carl Zeiss SMT GmbH (Germany)
Grizelda Kersteen, Carl Zeiss SMT GmbH (Germany)
Klaus Gwosch, Carl Zeiss SMT GmbH (Germany)
Daniel Pagel, Carl Zeiss SMT GmbH (Germany)


Published in SPIE Proceedings Vol. 10957:
Extreme Ultraviolet (EUV) Lithography X
Kenneth A. Goldberg, Editor(s)

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