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A uniform micro-bump formation method using electroplating
Author(s): Jung O. Son; Young Ho Kim; Kyung Heon Kim; Sun Ho Kim; Hyun Ja Im; Nam Hwan Kim; Han Jung
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Paper Abstract

Recently, infrared detectors have become increasingly dense and miniaturized. The development of micro solder bumps with small diameter and high aspect ratio is necessary for high pixel density and miniaturized infrared detectors. Indium solder bump has been used for infrared detectors because of its stability at low temperature, electrical conductivity and ductility. In this work, the method and results of forming indium bumps with uniform and high aspect ratio by electroplating is presented. In particular, the electroplating method for forming a uniform micro bump and the method for manufacturing a bump having a uniform height will be presented in detail. Finally, the result of indium bump made of pixel pitch 5 μm and 7.5 μm is presented.

Paper Details

Date Published: 7 May 2019
PDF: 5 pages
Proc. SPIE 11002, Infrared Technology and Applications XLV, 110022B (7 May 2019); doi: 10.1117/12.2518583
Show Author Affiliations
Jung O. Son, i3system, Inc. (Korea, Republic of)
Young Ho Kim, i3system, Inc. (Korea, Republic of)
Kyung Heon Kim, i3system, Inc. (Korea, Republic of)
Sun Ho Kim, Agency for Defense Development (Korea, Republic of)
Hyun Ja Im, Agency for Defense Development (Korea, Republic of)
Nam Hwan Kim, Agency for Defense Development (Korea, Republic of)
Han Jung, i3system, Inc. (Korea, Republic of)


Published in SPIE Proceedings Vol. 11002:
Infrared Technology and Applications XLV
Bjørn F. Andresen; Gabor F. Fulop; Charles M. Hanson, Editor(s)

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