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Integration of metasurfaces onto micro electro mechanical systems for active control of visible and IR light (Conference Presentation)
Author(s): Daniel Lopez

Paper Abstract

The design and implementation of metasurface-based flat lenses have come to the forefront of ongoing scientific research and technology development. These novel photonic devices use sub-wavelength metal or dielectric resonators spaced on a specific two-dimensional pattern that mimic the phase profile of conventional bulk optical elements. However, most of these structures, or metasurfaces, have so far been passive with its optical performance determined only by the spatial configuration of the metasurface constitutive elements. The development of dynamic metasurfaces is currently a growing area of research directed to obtain real-time tunable operation of metasurfaces and new physical phenomena not feasible with static metasurfaces. Faster reconfigurable metasurfaces can be achieved by incorporating nanostructures with different optical response onto MEMS based actuators. The MEMS-metasurface platform enables electrostatic control of curvature, tilt angle and deformation of metasurfaces, enabling flat and agile optical elements with micro-second reconfiguration time. These unique dynamic metasurfaces may provide new opportunities for information optics and imaging by performing complex signal processing directly in the optical domain. In this presentation, I will describe the fundamentals and advantages of incorporating metallic and dielectric metasurfaces onto MEMS devices and the challenges associated with their patterning and integration.

Paper Details

Date Published: 16 August 2019
PDF
Proc. SPIE 10958, Novel Patterning Technologies for Semiconductors, MEMS/NEMS, and MOEMS 2019, 1095804 (16 August 2019); doi: 10.1117/12.2517631
Show Author Affiliations
Daniel Lopez, Argonne National Lab. (United States)


Published in SPIE Proceedings Vol. 10958:
Novel Patterning Technologies for Semiconductors, MEMS/NEMS, and MOEMS 2019
Martha I. Sanchez; Eric M. Panning, Editor(s)

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