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Electrically measurable test structures to capture and classify EUV stochastics
Author(s): Hemant Vats; Ryan Ryoung Han Kim; Yasser Sherazi; Youssef Drissi; Kurt Ronse
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Paper Abstract

Advanced technology nodes are demanding aggressive printability using EUV. EUV printing process inherently brings in stochastic defects. To measure and experience various types of Stochastics in EUV printing, high volume measurements are deemed necessary. Furthermore the classification of the defects in terms of stochastic and systematic is also required. The permutation and combinations of shapes, sizes, and proximity driven stochastics errors are high in numbers, leading to significant increase in the number of test structures needed. Without electrically measurable solutions, the defect test measurement exercise becomes impractical to perform visually. This paper will describe few examples of developing and handling the test structures capable to capture the defects and defect location and further to classify the defects in terms of stochastic or systematic defects.

Paper Details

Date Published: 4 June 2019
PDF: 11 pages
Proc. SPIE 10957, Extreme Ultraviolet (EUV) Lithography X, 109571M (4 June 2019); doi: 10.1117/12.2515418
Show Author Affiliations
Hemant Vats, IMEC (Belgium)
Ryan Ryoung Han Kim, IMEC (Belgium)
Yasser Sherazi, IMEC (Belgium)
Youssef Drissi, IMEC (Belgium)
Kurt Ronse, IMEC (Belgium)


Published in SPIE Proceedings Vol. 10957:
Extreme Ultraviolet (EUV) Lithography X
Kenneth A. Goldberg, Editor(s)

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