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CMUT sensors based on circular membranes array for SHM applications
Author(s): P. Butaud; G. Bourbon; P. Le Moal; E. Joseph; B. Verdin; E. Ramasso; V. Placet
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Paper Abstract

A MEMS sensor dedicated to SHM applications is presented. The MEMS is made of a Capacitive Micromachined Ultrasonic Transducer (CMUT) chip composed of circular membranes array. The radius of the membranes varies between 50 μm and 250 μm and hence the associated resonance frequencies between 80 kHz and 2 MHz. A wide frequency bandwidth is then available for acoustic measurements. A testing campaign is conducted in order to characterize the MEMS sensor's behavior when subjected to single-frequency and broadband excitation stimuli. The single-frequency excitations are produced with specific piezoelectric transducers from 300 kHz to 800 kHz. The Fast Fourier Transform (FFT) of the measured signal from the CMUT is centered as expected on the excitation frequency. The broadband excitation is obtained with a pencil lead break. In this case, the FFT of the measured signal is centered on the resonance frequency of the membrane. These characterizations point out the DC bias voltage applied to the CMUT as a major parameter for controlling the sensitivity of the sensor. The CMUT sensor proves to be sufficiently sensitive to monitor these sources. This work highlights the relevant prospective capacities of the CMUT sensor to collect data in structural health monitoring applications. This sensor technology could be externally deployed, or even integrated into a composite structure, in order to monitor the structure by the CMUT detection, either by active ultrasound tests or by passive acoustic emission.

Paper Details

Date Published: 27 March 2019
PDF: 8 pages
Proc. SPIE 10970, Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2019, 1097027 (27 March 2019); doi: 10.1117/12.2515324
Show Author Affiliations
P. Butaud, Univ. Bourgogne Franche-Comté (France)
Institut Franche-Comte Electronique Mecanique Thermique et Optique (France)
G. Bourbon, Univ. Bourgogne Franche-Comté (France)
Institut Franche-Comte Electronique Mecanique Thermique et Optique (France)
P. Le Moal, Univ. Bourgogne Franche-Comté (France)
Institut Franche-Comte Electronique Mecanique Thermique et Optique (France)
E. Joseph, Univ. de Franche-Comté (France)
Institut Franche-Comte Electronique Mecanique Thermique et Optique (France)
B. Verdin, Univ. Bourgogne Franche-Comté (France)
Institut Franche-Comte Electronique Mecanique Thermique et Optique (France)
E. Ramasso, Univ. Bourgogne Franche-Comté (France)
Institut Franche-Comte Electronique Mecanique Thermique et Optique (France)
V. Placet, Univ. Bourgogne Franche-Comté (France)
Institut Franche-Comte Electronique Mecanique Thermique et Optique (France)


Published in SPIE Proceedings Vol. 10970:
Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2019
Jerome P. Lynch; Haiying Huang; Hoon Sohn; Kon-Well Wang, Editor(s)

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