Share Email Print
cover

Proceedings Paper • new

OPC model accuracy study using high volume contour based gauges and deep learning on memory device
Author(s): Young-Seok Kim; SeIl Lee; Zhenyu Hou; Yiqiong Zhao; Meng Liu; Yunan Zheng; Qian Zhao; Daekwon Kang; Lei Wang; Mark Simmons; Mu Feng; Jun Lang; Byoung-Il Choi; Gilbert Kim; Hakyong Sim; Jongcheon Park; Gyun Yoo; JeonKyu Lee; Sung-woo Ko; Jaeseung Choi; Cheolkyun Kim; Chanha Park
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

As the design node of memory device shrinks, OPC model accuracy is becoming ever more critical from development to manufacturing. To improve the model accuracy, more and more physical effects are analyzed and terms for those physical effects are added. But it is unachievable to capture the complete physical effects. In this study, deep neural network is employed and studied to improve model accuracy. Regularization is achieved using physical guidance model. To address overfitting issue, high volume of contour based edge placement (EP) gauges (>10K) are generated using fast eBeam tool (eP5) and metrology processing software (MXP) without increasing turnaround time. It is shown that the new approach improved model accuracy by >47% compared to traditional approach on >1.4K verification gauges.

Paper Details

Date Published: 26 March 2019
PDF: 5 pages
Proc. SPIE 10959, Metrology, Inspection, and Process Control for Microlithography XXXIII, 1095913 (26 March 2019); doi: 10.1117/12.2515274
Show Author Affiliations
Young-Seok Kim, ASML Brion (United States)
SeIl Lee, ASML Brion (United States)
Zhenyu Hou, ASML Brion (United States)
Yiqiong Zhao, ASML Brion (United States)
Meng Liu, ASML Brion (United States)
Yunan Zheng, ASML Brion (United States)
Qian Zhao, ASML Brion (United States)
Daekwon Kang, ASML Brion (United States)
Lei Wang, ASML Brion (United States)
Mark Simmons, ASML Brion (United States)
Mu Feng, ASML Brion (United States)
Jun Lang, ASML Brion (United States)
Byoung-Il Choi, ASML Brion (United States)
Gilbert Kim, ASML Brion (United States)
Hakyong Sim, SK Hynix Semiconductor Inc. (Korea, Republic of)
Jongcheon Park, SK Hynix Semiconductor Inc. (Korea, Republic of)
Gyun Yoo, SK Hynix Semiconductor Inc. (Korea, Republic of)
JeonKyu Lee, SK Hynix Semiconductor Inc. (Korea, Republic of)
Sung-woo Ko, SK Hynix Semiconductor Inc. (Korea, Republic of)
Jaeseung Choi, SK Hynix Semiconductor Inc. (Korea, Republic of)
Cheolkyun Kim, SK Hynix Semiconductor Inc. (Korea, Republic of)
Chanha Park, SK Hynix Semiconductor Inc. (Korea, Republic of)


Published in SPIE Proceedings Vol. 10959:
Metrology, Inspection, and Process Control for Microlithography XXXIII
Vladimir A. Ukraintsev; Ofer Adan, Editor(s)

© SPIE. Terms of Use
Back to Top