Share Email Print
cover

Proceedings Paper • new

Macro CDSEM 2D metrology supporting advanced DRAM patterning
Author(s): R. Kris; G. Klebanov; I. Schwarzband; E. Sommer; L. Gershtein; B. Mathew; E. Noifeld; S. Levy; R. Alkoken; O. Novak; H. Miroku; D. Rathore ; S. Pastur; S. Duvdevani-Bar; T. Bar-On; I. Horikawa
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

The growing demand for advanced DRAM technologies requires development of novel process control methodologies reflecting design rule shrinkage. The new challenges for CD SEM metrology of dense feature arrays of DRAM layers are widely considered in the literature and ITRS documents. In addition to traditional SEM metrology methods based on measurement of individual features, the development of novel measurement techniques is required for dense cell arrays at small nodes.[1-3] We considered a novel metrology of CDSEM Critical Dimension (CD) in dense arrays, formed as capacitors in advanced dynamic random-access memory (DRAM) layers. The proposed approach is based on traditional CDSEM metrology methodology with new developments providing flexibility, CD-style high precision, and large statistical sampling capabilities for advanced Statistical Process Control (SPC). The metrology challenge is solved through development of new algorithmic approaches for dense array measurements. The approach was validated on data simulation of extracting geometry (CD) parameters of actual DRAM cell structures and verified on real data.

Paper Details

Date Published: 8 April 2019
PDF: 8 pages
Proc. SPIE 10959, Metrology, Inspection, and Process Control for Microlithography XXXIII, 109592S (8 April 2019); doi: 10.1117/12.2515233
Show Author Affiliations
R. Kris, Applied Materials Israel (Israel)
G. Klebanov, Applied Materials Israel (Israel)
I. Schwarzband, Applied Materials Israel (Israel)
E. Sommer, Applied Materials Israel (Israel)
L. Gershtein, Applied Materials Israel (Israel)
B. Mathew, Applied Materials Israel (Israel)
E. Noifeld, Applied Materials Israel (Israel)
S. Levy, Applied Materials Israel (Israel)
R. Alkoken, Applied Materials Israel (Israel)
O. Novak, Applied Materials Israel (Israel)
H. Miroku, Applied Materials Japan (Japan)
D. Rathore , Applied Materials, Inc. (United States)
S. Pastur, Applied Materials Israel (Israel)
S. Duvdevani-Bar, Applied Materials Israel (Israel)
T. Bar-On, Applied Materials Israel (Israel)
I. Horikawa, Micron Japan Inc. (Japan)


Published in SPIE Proceedings Vol. 10959:
Metrology, Inspection, and Process Control for Microlithography XXXIII
Vladimir A. Ukraintsev; Ofer Adan, Editor(s)

© SPIE. Terms of Use
Back to Top