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Gas-enhanced PFIB surface preparation enabled metrology and statistical analysis of 3D NAND devices
Author(s): Micah Ledoux; James Clarke; Brett Avedisian; Chad Rue; Umesh Adiga; Mark Biedrzycki
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Paper Abstract

Process monitoring of critical dimensions and structural shapes in 3D NAND flash memory device manufacturing requires the precision, resolution, and speed of SEM image acquisition and metrology, with new challenges in the Z axis, as device capacity continues to grow. Automated, gas assisted PFIB surface preparation enables sampling at multiple, arbitrary heights in the memory cell stack at a rate fast enough support inline process control. This work reports on preparation and measurement of greater than 2000 devices, from three sites, at 3 layers, in <140 minutes from a commercially available 64 layer 3D NAND device. Automated SEM metrology is used as a fast and accurate method of surface analysis to determine the planar cell area, ellipsis, and position of the bits as a function of depth within the stack. These results and extended analyses provide insight into how the shape and size of the primary etch channel influences memory cell dimensional variation as a function of depth.

Paper Details

Date Published: 26 March 2019
PDF: 11 pages
Proc. SPIE 10959, Metrology, Inspection, and Process Control for Microlithography XXXIII, 109590I (26 March 2019); doi: 10.1117/12.2515069
Show Author Affiliations
Micah Ledoux, Thermo Fisher Scientific Inc. (United States)
James Clarke, Thermo Fisher Scientific Inc. (United States)
Brett Avedisian, Thermo Fisher Scientific Inc. (United States)
Chad Rue, Thermo Fisher Scientific Inc. (United States)
Umesh Adiga, Thermo Fisher Scientific Inc. (United States)
Mark Biedrzycki, Thermo Fisher Scientific Inc. (United States)


Published in SPIE Proceedings Vol. 10959:
Metrology, Inspection, and Process Control for Microlithography XXXIII
Vladimir A. Ukraintsev; Ofer Adan, Editor(s)

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