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Compact modeling of negative tone development resist with photo decomposable quencher
Author(s): Ao Chen; Kar Kit Koh; Yee Mei Foong; Bradley Morgenfeld; Jun Chen; Sandra Lee; Xi Chen; Hesham Omar; Mu Feng; ChangAn Wang; Keith Gronlund; Jun Lang; James Guerrero; Yiqiong Zhao
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Paper Abstract

In recent years, compact modeling of negative tone development (NTD) resists has been extensively investigated. Specific terms have been developed to address typical NTD effects, such as aerial image intensity dependent resist shrinkage and development loading. The use of photo decomposable quencher (PDQ) in NTD resists, however, brings extra challenges arising from more complicated and mixed resist effect. Due to pronounced effect of photoacid and base diffusion, the NTD resist with PDQ may exhibit opposite iso-dense bias trend compared with normal NTD resist. In this paper, we present detailed analysis of physical effects in NTD resist with PDQ, and describe respective terms to address each effect. To decouple different effects and evaluate the impact of individual terms, we identify a certain group of patterns that are most sensitive to specific resist effect, and investigate the corresponding term response. The results indicate that all the major resist effect, including PDQ-enhanced acid/base diffusion, NTD resist shrinkage and NTD development loading can be well captured by relevant terms. Based on these results, a holistic approach for the compact model calibration of NTD resist with PDQ can be established.

Paper Details

Date Published: 20 March 2019
PDF: 11 pages
Proc. SPIE 10961, Optical Microlithography XXXII, 109610F (20 March 2019); doi: 10.1117/12.2514784
Show Author Affiliations
Ao Chen, GLOBALFOUNDRIES Singapore Pte. Ltd. (Singapore)
Kar Kit Koh, GLOBALFOUNDRIES Singapore Pte. Ltd. (Singapore)
Yee Mei Foong, GLOBALFOUNDRIES Singapore Pte. Ltd. (Singapore)
Bradley Morgenfeld, GLOBALFOUNDRIES Inc. (United States)
Jun Chen, ASML Brion Technologies (United States)
Sandra Lee, ASML Brion Technologies (United States)
Xi Chen, ASML Brion Technologies (United States)
Hesham Omar, ASML Brion Technologies (United States)
Mu Feng, ASML Brion Technologies (United States)
ChangAn Wang, ASML Brion Technologies (United States)
Keith Gronlund, ASML Brion Technologies (United States)
Jun Lang, ASML Brion Technologies (United States)
James Guerrero, ASML Brion Technologies (United States)
Yiqiong Zhao, ASML Brion Technologies (United States)


Published in SPIE Proceedings Vol. 10961:
Optical Microlithography XXXII
Jongwook Kye; Soichi Owa, Editor(s)

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