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Standalone alignment technology enabling feed-forward compensation of on-product overlay errors
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Paper Abstract

A standalone alignment technology was developed as a fundamental solution to improve on-product overlay (OPO). It enables high performance alignment measurements, and delivers state-of-the-art feed-forward corrections to exposure scanners. Dense alignment sampling and high order alignment correction is effective for scanner fingerprint matching and for correcting heavy distortion at a wafer edge. A mark asymmetry correction is detailed as effective solution which improves the OPO performance for heavily processed wafers. An OPO test result showed significant improvement using its feed-forward corrections. A high accuracy topography sensor is described as a new metrology innovation. The standalone alignment technology provides critical metrology tool functions such as process monitoring as well.

Paper Details

Date Published: 26 March 2019
PDF: 6 pages
Proc. SPIE 10959, Metrology, Inspection, and Process Control for Microlithography XXXIII, 1095908 (26 March 2019); doi: 10.1117/12.2514777
Show Author Affiliations
Takehisa Yahiro, Nikon Corp. (Japan)
Junpei Sawamura, Nikon Corp. (Japan)
Sonyong Song, Nikon Corp. (Japan)
Sayuri Tanaka, Nikon Corp. (Japan)
Yuji Shiba, Nikon Corp. (Japan)
Satoshi Ando, Nikon Corp. (Japan)
Hiroyuki Nagayoshi, Nikon Corp. (Japan)
Jun Ishikawa, Nikon Corp. (Japan)
Masahiro Morita, Nikon Corp. (Japan)
Yuichi Shibazaki, Nikon Corp. (Japan)


Published in SPIE Proceedings Vol. 10959:
Metrology, Inspection, and Process Control for Microlithography XXXIII
Vladimir A. Ukraintsev; Ofer Adan, Editor(s)

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