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Process monitoring and control with tunable wavelength overlay coupled with simulation-to-measurement analysis
Author(s): Pedro Herrera; Kun Gao; Chen Dror; Eitan Hajaj; Alon Alexander Volfman; Raviv Yohanan; Vidya Ramanathan; Victoria Naipak; Renan Milo; Tal Yaziv; Nir BenDavid; Meng Wang; Hao Mei; Weihua Li; Xindong Gao; Dongyue Yang; Cheuk Wun Wong; Karsten Gutjahr; Xueli Hao; Tony Joung; Md. Motasim Bellah; DeNeil Park; Yue Zhou; Abhishek Gottipati
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Paper Abstract

As semiconductor technology nodes keep shrinking, ever-tightening on-product overlay (OPO) budgets coupled with continuous process development and improvement make it critical to have a robust and accurate metrology setup. Process monitoring and control is becoming increasingly important to achieve high yield production. In recently introduced advanced overlay (OVL) systems, a supercontinuum laser source is applied to facilitate the collection of overlay spectra to increase measurement stability. In this paper, an analysis methodology has been proposed to couple the measured overlay spectra with overlay simulation to extract exact process information from overlay spectra. This paper demonstrates the ability to use overlay spectra to capture and quantify process variation, which in turn can be used to calibrate the simulation stacks used to create the SCOL (scatterometry-based overlay) and AIM overlay metrology targets, and can be fed into the fab for process monitoring and improvement.

Paper Details

Date Published: 26 March 2019
PDF: 10 pages
Proc. SPIE 10959, Metrology, Inspection, and Process Control for Microlithography XXXIII, 1095928 (26 March 2019); doi: 10.1117/12.2514725
Show Author Affiliations
Pedro Herrera, KLA Corp. (United States)
Kun Gao, KLA Corp. (China)
Chen Dror, KLA Corp. (Israel)
Eitan Hajaj, KLA Corp. (Israel)
Alon Alexander Volfman, KLA Corp. (Israel)
Raviv Yohanan, KLA Corp. (Israel)
Vidya Ramanathan, KLA Corp. (United States)
Victoria Naipak, KLA Corp. (United States)
Renan Milo, KLA Corp. (Israel)
Tal Yaziv, KLA Corp. (Israel)
Nir BenDavid, KLA Corp. (Israel)
Meng Wang, KLA Corp. (United States)
Hao Mei, KLA Corp. (China)
Weihua Li, KLA Corp. (China)
Xindong Gao, KLA Corp. (China)
Dongyue Yang, GLOBALFOUNDRIES Inc. (United States)
Cheuk Wun Wong, GLOBALFOUNDRIES Inc. (United States)
Karsten Gutjahr, GLOBALFOUNDRIES Inc. (United States)
Xueli Hao, GLOBALFOUNDRIES Inc. (United States)
Tony Joung, GLOBALFOUNDRIES Inc. (United States)
Md. Motasim Bellah, GLOBALFOUNDRIES Inc. (United States)
DeNeil Park, GLOBALFOUNDRIES Inc. (United States)
Yue Zhou, GLOBALFOUNDRIES Inc. (United States)
Abhishek Gottipati, GLOBALFOUNDRIES Inc. (United States)


Published in SPIE Proceedings Vol. 10959:
Metrology, Inspection, and Process Control for Microlithography XXXIII
Vladimir A. Ukraintsev; Ofer Adan, Editor(s)

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