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Development of scalable optical packaging for integrated photonics (Conference Presentation)
Author(s): Peter O'Brien
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Paper Abstract

There is a growing demand for integrated photonic devices from a wide range of applications, including high-speed communications, medical devices and sensing. There has been significant research and development to address the demand for fiber-based optical interconnect for integrated photonic devices. However, applications such as medical diagnostics and remote sensing often require free-space coupling using micro optical components. As with fiber-based systems, packaging of micro optical components presents challenges in order to maximise coupling efficiencies and ensure packaging processes can be scaled to high-volume for cost-effective manufacturing. In this talk, I will present an overview of challenges in optical interconnect for integrated photonic devices, including Silicon, InP and SiN technologies. Factors including device layout, optical fiber and micro optical lens design will be reviewed. This includes the development of on-chip mode adaptors, improved device facet configurations for easier fiber packaging and specialty fibers which improve optical coupling efficiencies. The talk will also present information about the European Photonic Packaging Pilot Line, PIXAPP. The Pilot Line addresses the gap between early-stage prototypes and scaling to volume manufacturing. PIXAPP achieves this through the implementation of packaging design rules and working towards standard package designs. The talk will also present details of a novel optical test system which is being developed within the Pilot Line to ensure devices are characterised in advanced of packaging. PIXAPP is supporting a large number of companies develop their first photonics-based products and the talk will be of interest to those from a wide range of application areas.

Paper Details

Date Published: 4 March 2019
PDF
Proc. SPIE 10924, Optical Interconnects XIX, 1092413 (4 March 2019); doi: 10.1117/12.2514698
Show Author Affiliations
Peter O'Brien, Tyndall National Institute (Ireland)


Published in SPIE Proceedings Vol. 10924:
Optical Interconnects XIX
Henning Schröder; Ray T. Chen, Editor(s)

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