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Sensing sheets based on large area electronics for structural health monitoring of bridges
Author(s): Vivek Kumar; Levent E. Aygun; Naveen Verma; James C. Sturm; Branko Glisic
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Paper Abstract

Damage characterization often requires direct sensing due to the localization of the anomalous behavior near the cracks. Direct sensing, however, is expensive because of the need to deploy a dense array of individual sensors. Sensing sheets based on Large Area Electronics (LAE) and Integrated Circuits (ICs) are a novel solution to this problem. Such sensing sheets could span several square meters, with a dense array of strain sensors embedded on a polyimide substrate along with the relevant electronics allowing for direct sensing while keeping the costs low. Current studies on LAE based sensing sheets are limited to laboratory experiments. This paper explores the question of suitability of the sensing sheets as a viable option for real-life SHM based on LAE and ICs. Results of laboratory experiments on an aluminum beam are provided to demonstrate the performance of sensing sheets in ideal conditions. Then, the sensing sheets are employed on a pedestrian bridge already equipped with fiber-optic sensors. The strain measurements from the sensing sheets and the fiber-optic sensors are compared and sources of differences are discussed.

Paper Details

Date Published: 27 March 2019
PDF: 8 pages
Proc. SPIE 10970, Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2019, 109702G (27 March 2019); doi: 10.1117/12.2514223
Show Author Affiliations
Vivek Kumar, Princeton Univ. (United States)
Levent E. Aygun, Princeton Univ. (United States)
Naveen Verma, Princeton Univ. (United States)
James C. Sturm, Princeton Univ. (United States)
Branko Glisic, Princeton Univ. (United States)


Published in SPIE Proceedings Vol. 10970:
Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2019
Jerome P. Lynch; Haiying Huang; Hoon Sohn; Kon-Well Wang, Editor(s)

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