Share Email Print
cover

Proceedings Paper • new

Quo Vadis surface functionalization: How direct laser interference patterning tackle productivity and flexibility in industrial applications
Author(s): S. Alamri; B. Krupop; T. Steege; A. Aguilar-Morales; V. Lang; S. Storm; F. Schell; C. Zwahr; C. Kracht; M. Bieda; B. Voisiat; U. Klotzbach; A. F. Lasagni; T. Kunze
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Surfaces with well-defined features (e.g. periodic structures) have shown to exhibit outstanding properties. The design of these textured surfaces often follows a biomimetic approach motivated by living organisms which developed over time through natural selection and evolution. The efficient production of these versatile patterns still represents one of the greatest technical challenges today in the development of new customized surface functionalities. Direct Laser Interference Patterning (DLIP) has been identified as an outstanding technology for the efficient fabrication of tailored surface structures. This method can show impressive processing speeds (up to 1 m²/min) as well as a superior flexibility in producing extremely versatile surface structures. This work gives an overview about recent developments of the DLIP technology by focusing on the topics: structure flexibility, process productivity, technical implementations and recent examples of achieved surface functionalities.

Paper Details

Date Published: 4 March 2019
PDF: 9 pages
Proc. SPIE 10906, Laser-based Micro- and Nanoprocessing XIII, 109060S (4 March 2019); doi: 10.1117/12.2514209
Show Author Affiliations
S. Alamri, Fraunhofer IWS Dresden (Germany)
B. Krupop, Fraunhofer IWS Dresden (Germany)
T. Steege, Fraunhofer IWS Dresden (Germany)
A. Aguilar-Morales, Fraunhofer IWS Dresden (Germany)
V. Lang, Fraunhofer IWS Dresden (Germany)
S. Storm, Fraunhofer IWS Dresden (Germany)
F. Schell, Fraunhofer IWS Dresden (Germany)
C. Zwahr, Fraunhofer IWS Dresden (Germany)
TU Dresden (Germany)
C. Kracht, Fraunhofer IWS Dresden (Germany)
M. Bieda, Fraunhofer IWS Dresden (Germany)
B. Voisiat, TU Dresden (Germany)
U. Klotzbach, Fraunhofer IWS Dresden (Germany)
A. F. Lasagni, Fraunhofer IWS Dresden (Germany)
TU Dresden (Germany)
T. Kunze, Fraunhofer IWS Dresden (Germany)


Published in SPIE Proceedings Vol. 10906:
Laser-based Micro- and Nanoprocessing XIII
Udo Klotzbach; Akira Watanabe; Rainer Kling, Editor(s)

© SPIE. Terms of Use
Back to Top