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Industrial applications of electro-mechanical impedance technique in novel non-bonded configurations
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Paper Abstract

Ease of implementation of any sensor system must involve simple instrumentation techniques along with adequate adaptability to change in specimen configuration. The past decade has witnessed an exponential upsurge in applications of piezoelectric transducers in various fields of engineering and biotechnology, whereas sensor types has remained the same, narrowing its suitability in certain fields. The present research deals with development of two novel piezo sensor configurations namely the single clamp non-bonded sensor (SCNS) and re-useable bolted sensor (RBS). The sensor was developed to accommodate change in dimension and is tested on different specimens based on its design. Fundamentally, SCNS is developed for circular structures such as pipelines and RBS is developed for 2-D plates. Effectiveness of both sensors is tested by mounting it on a specimen based on its design. Damage sensitivity of the sensors was studied by analysing the conductance signatures extracted from the piezo patches based on electromechanical impedance (EMI) technique. Repeatability of less than 2% was observed in both cases. At different levels of damage created shifts in signatures is observed. A statistical index used to quantify the amount of shift showed a gradual increase in magnitude corresponding to increase in damage. Similar trends are observed in both sensor data making both sensors suitable for application. Through the damage sensitivity tests, SCNS and RBS its proved viability for application in field studies. However, it might be noted that all tests were conducted in controlled environments of temperature and pressure and negating its effects by application of correction factors must be carried out for field application.

Paper Details

Date Published: 27 March 2019
PDF: 7 pages
Proc. SPIE 10970, Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2019, 109700A (27 March 2019); doi: 10.1117/12.2513870
Show Author Affiliations
Jayalakshmi Raju, Indian Institute of Technology Delhi (India)
Suresh Bhalla, Indian Institute of Technology Delhi (India)
Visalakshi Talakokula, Bennett Univ. (India)
Supriya Thakur, Indian Institute of Technology Delhi (India)


Published in SPIE Proceedings Vol. 10970:
Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2019
Jerome P. Lynch; Haiying Huang; Hoon Sohn; Kon-Well Wang, Editor(s)

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