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Problems, challenges, and a critical survey on automated silicon photonics packaging and optical interconnection
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Paper Abstract

The only way to make silicon photonics technology completely exploitable at industrial level for volume production is to solve the manufacturing bottlenecks that nowadays limit the applicability of the technology, in particular related to the multiple optical interconnection and the III-V chip integration. This paper will give a survey, based principally on the work made at Inphotec labs, on the problems and the challenges related to the optical interconnections to silicon photonic devices and their impact on process automation. It will give some update to what we are currently doing and developing in our labs utilizing a custom state of the art pigtailing-automated bench, robotics, including their present limitations.

Paper Details

Date Published: 4 March 2019
PDF: 15 pages
Proc. SPIE 10924, Optical Interconnects XIX, 1092415 (4 March 2019); doi: 10.1117/12.2513593
Show Author Affiliations
Giovan Battista Preve, INPHOTEC Foundation (Italy)
National Inter-Univ. Consortium for Telecommunication (Italy)


Published in SPIE Proceedings Vol. 10924:
Optical Interconnects XIX
Henning Schröder; Ray T. Chen, Editor(s)

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