Share Email Print
cover

Proceedings Paper • new

The application of telecoms-style packaging techniques to narrow linewidth laser modules for quantum technologies
Author(s): W. Dorward; S. T. Lee; D. Bremner; S. Robertson; B. Jones; C. Carson; L. McKnight
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Quantum Technologies (QT) hold the promise of a step-change improvement in many high-impact applications, such as ultra-stable clocks and extremely sensitive gravity and acceleration sensors for financial transaction timestamping, satellite-free navigation, oil and gas prospecting, land-surveying, secure communications and scientific research. The underpinning scientific principles of QT systems are largely developed, but for QT to fulfill its potential then orders of magnitude reduction in size, cost and power consumption of the enabling technologies is required. Stabilized laser systems are key ingredients of many quantum sensors. In many cases multiple lasers, each with specific wavelength, power and linewidth requirements, are needed for cooling, trapping, imaging and the clock references. In this paper we describe the design and packaging of a compact, frequency-stabilized 780nm laser module with integrated vapor reference cell. This stabilized source addresses the D2 transition of 87Rb that connects the ground and excited states, which is used for laser cooling, trapping and repumping in a rubidium interferometer. Component packaging techniques more normally employed in telecoms component packaging are utilized to minimize size and maximize stability. The resulting laser module lends itself to usage in applications in portable instruments outside of the lab.

Paper Details

Date Published: 4 March 2019
PDF: 7 pages
Proc. SPIE 10899, Components and Packaging for Laser Systems V, 1089908 (4 March 2019); doi: 10.1117/12.2513183
Show Author Affiliations
W. Dorward, Optocap Ltd. (United Kingdom)
S. T. Lee, Optocap Ltd. (United Kingdom)
D. Bremner, Optocap Ltd. (United Kingdom)
S. Robertson, Optocap Ltd. (United Kingdom)
B. Jones, Fraunhofer Ctr. for Applied Photonics (United Kingdom)
C. Carson, Fraunhofer Ctr. for Applied Photonics (United Kingdom)
L. McKnight, Fraunhofer Ctr. for Applied Photonics (United Kingdom)


Published in SPIE Proceedings Vol. 10899:
Components and Packaging for Laser Systems V
Alexei L. Glebov; Paul O. Leisher, Editor(s)

© SPIE. Terms of Use
Back to Top