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Evaluation of interfacial and micro-damage sensing of composites via Pencil Lead Drawing Paper Sensor (PLDPS) and Electrical Resistance (ER) mapping
Author(s): J. M. Park; P. S. Shin; J. H. Kim; H. S. Park; Y. M. Baek; L. K. DeVries
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Paper Abstract

The pencil lead drawing paper sensor (PLDPS) is a flexible and wearable sensing device, a new concept sensor that offers a tremendous potential feasibility for a variety of applications. Highly responsive, sensitive, low cost, easy-tohandle pencil lead graphite and paper made from cellulose pulp fibers extracted from wood, rags or grass, which are inexpensive, nature-friendly materials were used. The sensing effect on 3 different papers (Plane, Hwasun, and Han papers) based on the properties of PLDPS was compared via FT-IR, tensile test, optical observation and initial electrical resistance (ER). The interfacial and mechanical properties of epoxy and GF/epoxy composites were evaluated by damage sensing and ER mapping using PLDPS with impact, flexural, and interlaminar shear strength (ILSS) tests. The optimum type of paper used as the adherend for the pencil sensor was chosen as the plane paper. As glass fiber (GF)/epoxy composites were severely damaged, the large change in ER of PLDPS was observed distinctly.

Paper Details

Date Published: 27 March 2019
PDF: 7 pages
Proc. SPIE 10970, Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2019, 1097017 (27 March 2019); doi: 10.1117/12.2512544
Show Author Affiliations
J. M. Park, Gyeongsang National Univ. (Korea, Republic of)
The Univ. of Utah (United States)
P. S. Shin, Gyeongsang National Univ. (Korea, Republic of)
J. H. Kim, Gyeongsang National Univ. (Korea, Republic of)
H. S. Park, Gyeongsang National Univ. (Korea, Republic of)
Y. M. Baek, Gyeongsang National Univ. (Korea, Republic of)
L. K. DeVries, The Univ. of Utah (United States)


Published in SPIE Proceedings Vol. 10970:
Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2019
Jerome P. Lynch; Haiying Huang; Hoon Sohn; Kon-Well Wang, Editor(s)

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