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Proceedings Paper

Bonding techniques for single crystal TFT AMLCDs
Author(s): Sonja van der Groen; Maarten Rosmeulen; Philippe Jansen; Ludo Deferm; Christiaan Baert
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Paper Abstract

Transmissive single crystal AMLCD light valves have recently drawn much attention for application in flat panel displays. The active matrix circuits are fabricated on SIMOX wafers and then transferred to glass. Circuit transfer consists in bonding a CMOS processed SIMOX wafer to a Pyrex glass substrate, thinning the SIMOX wafer and opening the contact pads. The pixel electrodes are made in polysilicon to allow standard CMOS processing. This paper discusses the transparency of the poly electrode and evaluates the potential of anodic bonding and adhesive bonding for circuit transfer. A major challenge for anodic bonding is the protection of the device dielectrics against the high voltages applied during bonding. A test chip was designed to investigate different ways of circumventing breakdown of the dielectrics. A method for adhesive bonding is discussed that assures good uniformity of the thickness of the epoxy layer and avoids the inclusion of air bubbles. It is demonstrated that the epoxies are resistant to the chemicals used for thinning the silicon substrate.

Paper Details

Date Published: 23 September 1996
PDF: 7 pages
Proc. SPIE 2881, Microelectronic Structures and MEMS for Optical Processing II, (23 September 1996); doi: 10.1117/12.251250
Show Author Affiliations
Sonja van der Groen, IMEC (Belgium)
Maarten Rosmeulen, IMEC (Belgium)
Philippe Jansen, IMEC (Belgium)
Ludo Deferm, IMEC (Belgium)
Christiaan Baert, IMEC (Belgium)

Published in SPIE Proceedings Vol. 2881:
Microelectronic Structures and MEMS for Optical Processing II
M. Edward Motamedi; Wayne Bailey, Editor(s)

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