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Proceedings Paper

Tradeoffs in MEMS materials
Author(s): Cleopatra Cabuz
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Paper Abstract

To control the third dimension of micro mechanical structures, new materials have to be designed. Unfortunately, increased manufacturability results generally in degraded mechanical and electrical characteristics. The paper is presenting a detailed analysis of p+ silicon as a mechanical material for microresonators and of the low temperature dielectrics used in electrostatic microactuators. All the relevant parameters of p+ silicon are experimentally determined and process recommendations allowing improved quality are formulated. Charge injection and trapping in low temperature dielectrics are analyzed and their impact on the behavior of the electrostatic actuators evaluated.

Paper Details

Date Published: 23 September 1996
PDF: 11 pages
Proc. SPIE 2881, Microelectronic Structures and MEMS for Optical Processing II, (23 September 1996); doi: 10.1117/12.251245
Show Author Affiliations
Cleopatra Cabuz, Honeywell Technology Ctr. (United States)


Published in SPIE Proceedings Vol. 2881:
Microelectronic Structures and MEMS for Optical Processing II
M. Edward Motamedi; Wayne Bailey, Editor(s)

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