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Proceedings Paper

Eutectic bonds on wafer scale by thin film multilayers
Author(s): Carsten Christensen; Siebe Bouwstra
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Paper Abstract

The use of gold based thin film multilayer systems for forming eutectic bonds on wafer scale is investigated and preliminary results will be presented. On polished 4 inch wafers different multilayer systems are developed using thin film techniques and bonded afterwards under reactive atmospheres and different bonding temperatures and forces. Pull tests are performed to extract the bonding strengths.

Paper Details

Date Published: 23 September 1996
PDF: 3 pages
Proc. SPIE 2879, Micromachining and Microfabrication Process Technology II, (23 September 1996); doi: 10.1117/12.251228
Show Author Affiliations
Carsten Christensen, Technical Univ. of Denmark (Denmark)
Siebe Bouwstra, Technical Univ. of Denmark (Denmark)


Published in SPIE Proceedings Vol. 2879:
Micromachining and Microfabrication Process Technology II
Stella W. Pang; Shih-Chia Chang, Editor(s)

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