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Proceedings Paper

Electrodeposition of 3D microstructures without molds
Author(s): Andreas Maciossek
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Paper Abstract

A new fabrication process for the generation of 3D microstructures is presented. On the base of electrodeposition, microstructures of different 3D shapes could be formed without using molds. This method can be applied for realizing new components for surface micro machining. Furthermore, it can be used as an ad-on process to almost all process technologies and it make use of standard equipment. Also presented is a calculation of linearly increasing structures by the example of wedge shaped plans. The main idea of the new technology is the controlled overplating of patterned plating base sequences.

Paper Details

Date Published: 23 September 1996
PDF: 5 pages
Proc. SPIE 2879, Micromachining and Microfabrication Process Technology II, (23 September 1996); doi: 10.1117/12.251226
Show Author Affiliations
Andreas Maciossek, Fraunhofer-Institut fuer Siliziumtechnologie (Germany)


Published in SPIE Proceedings Vol. 2879:
Micromachining and Microfabrication Process Technology II
Stella W. Pang; Shih-Chia Chang, Editor(s)

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