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Proceedings Paper

Microelectro discharge machining as a technology in micromachining
Author(s): Wolfgang Ehrfeld; Heinz Lehr; Frank Michel; Andrej Wolf; Hans-Peter Gruber; Axel Bertholds
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Paper Abstract

In recent years, machine facilities for Electro Discharge Machining (EDM) have been dramatically improved. Enormous progress has been obtained with respect to form accuracy and structure precision even in the submicron domain, which qualifies EDM as a technology for microfabrication ((mu) EDM). (Mu) EDM therefore extends the family of existing microtechniques e.g. the LIGA process or silicon surface micromachining. The EDM-technology offers 3D microfabrication of conductive materials independent of their mechanical properties like hardness, brittleness, etc. This capability offers new fields of application for the microfabrication of components made e.g. from stainless steel or titanium. In order to demonstrate the successful application of various (mu) EDM processes components and devices like micro gearwheels, microreactors, micro punching tools and mould inserts for micro injection molding of an optical fiber connector are presented, which have been fabricated by EDM in close cooperation between the Institute of Microtechnology Mainz GmbH and the Swiss EDM-manufacturer AGIE Losone. Based on their know-how the partners aim to optimize (mu) EDM for microfabrication purposes.

Paper Details

Date Published: 23 September 1996
PDF: 6 pages
Proc. SPIE 2879, Micromachining and Microfabrication Process Technology II, (23 September 1996); doi: 10.1117/12.251221
Show Author Affiliations
Wolfgang Ehrfeld, Institute for Microtechnology Mainz GmbH (Germany)
Heinz Lehr, Institute for Microtechnology Mainz GmbH (Germany)
Frank Michel, Institute for Microtechnology Mainz GmbH (Germany)
Andrej Wolf, Institute for Microtechnology Mainz GmbH (Germany)
Hans-Peter Gruber, AGIE (Switzerland)
Axel Bertholds, AGIE (Switzerland)


Published in SPIE Proceedings Vol. 2879:
Micromachining and Microfabrication Process Technology II
Stella W. Pang; Shih-Chia Chang, Editor(s)

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