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Proceedings Paper

Dry etching and micromachining of precision silicon components
Author(s): Ernst-Wolfgang Kreutz; Wilhelm Pfleging; David A. Wesner; Juergen Jandeleit; G. Urbasch
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Paper Abstract

Dry etching and micromachining with laser radiation of short wavelength and pulse length are investigated to present their process capabilities for the production of surface structures within precision silicon components. The laser dry etching processing with excimer laser radiation is modified by using a microwave-excited processing gas. Furthermore, methylmethacrylate is additionally used to study the influence of polymerization on the etched structures. The micromachining with frequency-doubled Nd:YLF laser radiation is performed yielding more precise structures during drilling and caving due to the lower heat and pressure load during the interaction time. The processes involved in dry etching and micromachining with laser radiation are studied by high-speed photography, mass spectroscopy and optical spectroscopy, whereas the produced structures are analyzed by profilometry, optical and electron microscopy as well as electron spectroscopy such as XPS and AES. The results are discussed in view of applications for surface patterning of precision silicon components.

Paper Details

Date Published: 23 September 1996
PDF: 8 pages
Proc. SPIE 2879, Micromachining and Microfabrication Process Technology II, (23 September 1996); doi: 10.1117/12.251212
Show Author Affiliations
Ernst-Wolfgang Kreutz, RWTH Aachen (Germany)
Wilhelm Pfleging, RWTH Aachen (Germany)
David A. Wesner, RWTH Aachen (Germany)
Juergen Jandeleit, RWTH Aachen (Germany)
G. Urbasch, RWTH Aachen (Germany)


Published in SPIE Proceedings Vol. 2879:
Micromachining and Microfabrication Process Technology II
Stella W. Pang; Shih-Chia Chang, Editor(s)

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