Share Email Print
cover

Proceedings Paper

Simple technology for fabricating micromechanical 3D structures using electroplating without photoresist mold
Author(s): Bahram Ghodsian; M. Parameswaran; Marek Syrzycki
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

In this work, we have developed a simple method to fabricate 3D microstructures which eliminates the use of photoresist as molding material. Our method of pattern transfer exploits the anisotropic etch of silicon using EDP or TMAH which allows fabrication of unique structures that would have not been possible by the photoresist-mold method. In this technology the etched silicon substrate itself is used as the mold for subsequent electroplating process to deposit metallic material such as gold, nickel, or iron-nickel alloy. These electroplated microstructures can be easily removed from the silicon mold by choosing an appropriate seed layer which gives poor adhesion to silicon or silicon dioxide substrate. Using this technology metallic microstructures with thicknesses of 300 micrometers has been fabricated to demonstrate the feasibility. We have also fabricated a sharp tip, pyramidal structures suitable for ionization detectors in an integrated micromachined gas chromatographic system.

Paper Details

Date Published: 23 September 1996
PDF: 10 pages
Proc. SPIE 2879, Micromachining and Microfabrication Process Technology II, (23 September 1996); doi: 10.1117/12.251207
Show Author Affiliations
Bahram Ghodsian, Simon Fraser Univ. (Canada)
M. Parameswaran, Simon Fraser Univ. (Canada)
Marek Syrzycki, Simon Fraser Univ. (Canada)


Published in SPIE Proceedings Vol. 2879:
Micromachining and Microfabrication Process Technology II
Stella W. Pang; Shih-Chia Chang, Editor(s)

© SPIE. Terms of Use
Back to Top