Share Email Print
cover

Proceedings Paper

Cutting and drilling of CVD diamond using a copper vapor laser
Author(s): Rudimar Riva; B. Christ; Nicolau A. S. Rodrigues; Vladimir Jesus Trava-Airoldi; Evaldo J. Corat
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

In this work we present the results of CVD-diamond processing using a copper vapor laser. With a self filtering unstable resonator the laser produces an average power of 9 watts in a 3.5 times limited diffraction beam at a 10 KHz repetition rate. The laser beam is focused on the diamond surface using a lens with a 150 mm focal distance producing a spot size of 70 microns. The laser intensity achieves 2 GW/cm2 on the focus. Electronic microscopy of the processed samples showed clean cut and drill with the whole diameter coincident to the laser beam spot size. Since diamond has a very high thermal diffusivity the temperature rise due to the average power would not be enough to promote evaporation, thus it was concluded that the diamond processing is only die to the laser peak power. Diamond burr with 1.0 mm diameter were cut with the same apparatus at a linear velocity of 200 mm/hour showing a clear and shape cut.

Paper Details

Date Published: 23 September 1996
PDF: 7 pages
Proc. SPIE 2789, High-Power Lasers: Applications and Emerging Applications, (23 September 1996); doi: 10.1117/12.251195
Show Author Affiliations
Rudimar Riva, Instituto de Estudos Avancados/CTA (Brazil)
B. Christ, Instituto de Estudos Avancados/CTA (Brazil)
Nicolau A. S. Rodrigues, Instituto de Estudos Avancados/CTA (Brazil)
Vladimir Jesus Trava-Airoldi, Lab. Associado de Sensores e Materiais/INPE (Brazil)
Evaldo J. Corat, Lab. Associado de Sensores e Materiais/INPE (Brazil)


Published in SPIE Proceedings Vol. 2789:
High-Power Lasers: Applications and Emerging Applications
Georges Sayegh; Michael R. Osborne, Editor(s)

© SPIE. Terms of Use
Back to Top