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Full automatic test environment for high-throughput PIC testing
Author(s): Colin Dankwart; Moritz Seyfried; Torsten Vahrenkamp
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Paper Abstract

The market of Photonic integrated circuits (PICs) has risen significantly in the previous decade. One of the major challenges to SMEs is to reduce cost and effort of packaging and pre-package testing. The PIXAPP pilot line aims to address these challenges and fill missing links in the technology chain in the context of photonics pilot manufacturing. As part of the PIXAPP pilot line, we enable time-efficient PIC characterization and validation, which is indispensable for a cost-effective manufacturing chain. A fast alignment process of optical in- and outputs to the PIC is critical to reduce the cycle times for testing. There are many underlying factors that influence achievable alignment times, such as mode field diameter, mode mismatch between waveguide and fiber, available optical power, measurement noise, the mechanical properties of the setup, controller environment, strategies used to find first light, alignment algorithms and parallelization by employing fiber arrays. We discuss a selection of these factors. Among the covered topics are the available acceleration of the mechanical axes, fiber holder stiffness, motion controller frequency and parallelization by Periscope arrays for edge coupling on the wafer scale. We demonstrate the applicability of our findings by a double sided fiber alignment in 1.7s.

Paper Details

Date Published: 8 April 2019
PDF: 7 pages
Proc. SPIE 10899, Components and Packaging for Laser Systems V, 108990N (8 April 2019); doi: 10.1117/12.2511039
Show Author Affiliations
Colin Dankwart, ficonTEC Service GmbH (Germany)
Moritz Seyfried, ficonTEC Service GmbH (Germany)
Torsten Vahrenkamp, ficonTEC Service GmbH (Germany)


Published in SPIE Proceedings Vol. 10899:
Components and Packaging for Laser Systems V
Alexei L. Glebov; Paul O. Leisher, Editor(s)

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