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Fabrication of multicomponent semiconductor microspheres by laser ablation in air (Conference Presentation)
Author(s): Daisuke Nakamura; Yuichiro Wakiyama; Hiroki Oshima; Mitsuhiro Higashihata; Hiroshi Ikenoue; Nilesh J. Vasa; M. S. Ramachandra Rao
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Paper Abstract

We have demonstrated the fabrication of semiconductor microspherical crystals such as ZnO and Si microspheres by a simple laser ablation technique. In addition, doped and alloyed microspheres have achieved by this technique. The fabrication mechanism of the spherical crystals is based on instantaneous heating of target material, formation of spherical shape by surface tension of liquid-state material, and rapid freezing with keeping the spherical shape. In this study, the technique is expanded to other various materials, and microspheres consisting of multicomponent semiconductor such as Sr3Sn2O7 was successfully fabricated. This technique is a candidate for fabrication of functional microspherical crystals.

Paper Details

Date Published: 13 March 2019
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Proc. SPIE 10905, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXIV, 1090510 (13 March 2019); doi: 10.1117/12.2510985
Show Author Affiliations
Daisuke Nakamura, Kyushu Univ. (Japan)
Yuichiro Wakiyama, Kyushu Univ. (Japan)
Hiroki Oshima, Kyushu Univ. (Japan)
Mitsuhiro Higashihata, Kyushu Univ. (Japan)
Hiroshi Ikenoue, Kyushu Univ. (Japan)
Nilesh J. Vasa, Indian Institute of Technology Madras (India)
M. S. Ramachandra Rao, Indian Institute of Technology Madras (India)


Published in SPIE Proceedings Vol. 10905:
Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXIV
Tetsuya Makimura; Gediminas Račiukaitis; Carlos Molpeceres, Editor(s)

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