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Through-substrate coupling elements for silicon-photonics-based short-reach optical interconnects
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Paper Abstract

Laser integration and photonics chip packaging are the two key challenges that require attention to drive down the cost/bit metric for silicon photonics based optical interconnects. We try to address the latter by demonstrating optical interfaces that fit well in an overall scheme of 2.5D/3D electro-optic integration needed for a high performance computing environment. A through-substrate coupling interface provides the benefit of bonding a silicon photonic chip face-up on a package substrate such that the device-side of the chip remains accessible for die-stacking and fiber-array packaging, thereby offering a promising alternative to flip-chip based packaging. In this paper, we demonstrate three through-substrate coupling elements to enable alignment tolerant and energy-efficient integration of silicon photonics with board-level or package-level optical interconnects : (i) a downward directionality O-band grating coupler with a peak -2.3 dB fiber-to-silicon waveguide coupling efficiency; (ii) polymer microlenses hybrid integrated onto the substrate of a silicon photonic chip to produce an expanded collimated beam at λ=1310 nm for a distance of more than 600 μm; (iii) a ball lens placed in a through-package via to result in a 14 μm chip-to-package 1-dB lateral alignment tolerance for coupling into a 20×24 µm squared cross-section board-level polymer waveguide.

Paper Details

Date Published: 4 March 2019
PDF: 12 pages
Proc. SPIE 10924, Optical Interconnects XIX, 109240D (4 March 2019); doi: 10.1117/12.2510594
Show Author Affiliations
Nivesh Mangal, IMEC (Belgium)
Univ. Gent (Belgium)
Jeroen Missinne, Univ. Gent (Belgium)
Joris Van Campenhout, IMEC (Belgium)
Geert Van Steenberge, Univ. Gent (Belgium)
Bradley Snyder, IMEC (Belgium)


Published in SPIE Proceedings Vol. 10924:
Optical Interconnects XIX
Henning Schröder; Ray T. Chen, Editor(s)

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