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Most compact and versatile 3D marking system
Author(s): Albert Seifert; Stefan Marzenell; Wolfram Schöne; Steffen Ehrenmann
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Paper Abstract

The demand for marking systems to create durable marks has led to a significant growth of lasers in manufacturing. Qswitched nanosecond pulsed solid state or fiber lasers are used for most of the marking applications today. Manufacturer of marking systems have pushed this growth by providing more powerful or more compact systems. We were able to reduce the overall size of the 3D laser marking head to approx. ½ cubic foot. This reduction in size was possible due to improved pump sources providing higher brightness, improved laser designs, improved electronic design and state of the art packaging technology. The size of approx. 1/2 cubic foot is the most compact full 3D marking system available. In addition, our new laser marking system based on a diode pumped solid state laser shows superior performance compared to laser marking systems based on fiber lasers of the same or even higher average power. We will show marking applications in terms of black engraving, annealing and high quality bitmap marking. Due to the optimized optical layout of the 3D marking system, it is possible to mark 3D shaped objects using the same laser parameters even with objects of different heights. We will present results of a 3D annealing application. Additionally, to achieve high productivity, the laser has to be integrated very easily into the production system in terms of mechanics, optics and software control.

Paper Details

Date Published: 27 February 2019
PDF: 7 pages
Proc. SPIE 10911, High-Power Laser Materials Processing: Applications, Diagnostics, and Systems VIII, 109110B (27 February 2019); doi: 10.1117/12.2510110
Show Author Affiliations
Albert Seifert, TRUMPF Schweiz AG (Switzerland)
Stefan Marzenell, TRUMPF Schweiz AG (Switzerland)
Wolfram Schöne, TRUMPF Schweiz AG (Switzerland)
Steffen Ehrenmann, TRUMPF Laser- und Systemtechnik (Germany)


Published in SPIE Proceedings Vol. 10911:
High-Power Laser Materials Processing: Applications, Diagnostics, and Systems VIII
Stefan Kaierle; Stefan W. Heinemann, Editor(s)

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