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3D photonic integrated 4x4 multi-mode interference coupler
Author(s): Madeleine Nuck; Moritz Kleinert; Hauke Conradi; David de Felipe; Crispin Zawadazki; Anja Scheu; Martin Kresse; Walter Brinker; Norbert Keil; Martin Schell
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Paper Abstract

3D photonic integration introduces a new degree of freedom in the design of photonic integrated circuits (PICs) compared to standard 2D-like structures. Novel applications such as large-scale optical switching matrices, e.g. for top-of- rack cross connect switches in data centers, benefit from the additional design flexibility due to their waveguide crossing-free architecture and compact footprint. In this work, a novel 3D 4×4 multi-mode interference coupler (MMI) based on HHI’s polymer-based photonic integration platform PolyBoard is presented. The fabrication process of the PolyBoard platform allows for the realization of vertically stacked polymer waveguide layers. Cascading two of the presented 3D 4×4 MMIs will form the building block of future large-scale 3D switching matrices. The 3D 4×4 MMI structure comprises two waveguide layers separated by a distance of 7.2 μm, with two input and two output waveguides in each layer, and a multimode interference (MMI) section in between. The vertical MMI section serves as the interconnection between the different waveguide layers and distributes the incoming light from each input waveguide across the four output ports of the 4×4 MMI. Design rules and fabrication methodology of these novel structures are presented in detail. Preliminary measurements demonstrate the proof-of-concept indicating an insertion loss below 9.3 dB, including fiber-chip coupling loss and the 6 dB intrinsic loss.

Paper Details

Date Published: 4 March 2019
PDF: 9 pages
Proc. SPIE 10921, Integrated Optics: Devices, Materials, and Technologies XXIII, 109211C (4 March 2019); doi: 10.1117/12.2509776
Show Author Affiliations
Madeleine Nuck, Fraunhofer-Institut für Nachrichtentechnik Heinrich-Hertz-Institut (Germany)
Moritz Kleinert, Fraunhofer-Institut für Nachrichtentechnik Heinrich-Hertz-Institut (Germany)
Hauke Conradi, Fraunhofer-Institut für Nachrichtentechnik Heinrich-Hertz-Institut (Germany)
David de Felipe, Fraunhofer-Institut für Nachrichtentechnik Heinrich-Hertz-Institut (Germany)
Crispin Zawadazki, Fraunhofer-Institut für Nachrichtentechnik Heinrich-Hertz-Institut (Germany)
Anja Scheu, Fraunhofer-Institut für Nachrichtentechnik Heinrich-Hertz-Institut (Germany)
Martin Kresse, Fraunhofer-Institut für Nachrichtentechnik Heinrich-Hertz-Institut (Germany)
Walter Brinker, Fraunhofer-Institut für Nachrichtentechnik Heinrich-Hertz-Institut (Germany)
Norbert Keil, Fraunhofer-Institut für Nachrichtentechnik Heinrich-Hertz-Institut (Germany)
Martin Schell, Fraunhofer-Institut für Nachrichtentechnik Heinrich-Hertz-Institut (Germany)


Published in SPIE Proceedings Vol. 10921:
Integrated Optics: Devices, Materials, and Technologies XXIII
Sonia M. García-Blanco; Pavel Cheben, Editor(s)

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